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  lm185-1.2qml www.ti.com snvs384b ? october 2005 ? revised january 2014 lm185-1.2qml micropower voltage reference diode check for samples: lm185-1.2qml 1 features description the lm185-1.2 is a micropower 2-terminal band-gap 2 ? operating current of 10 a to 20ma voltage regulator diodes. operating over a 10 a to ? 1 maximum dynamic impedance (typical) 20ma current range, it features exceptionally low ? low temperature coefficient dynamic impedance and good temperature stability. on-chip trimming is used to provide tight voltage ? radiation qualified option tolerance. since the lm185-1.2 band-gap reference ? 100 krad uses only transistors and resistors, low noise and ? low dose rate tested at 10 mrad/s good long term stability result. careful design of the lm185-1.2 has made the device exceptionally tolerant of capacitive loading, making it easy to use in almost any reference application. the wide dynamic operating range allows its use with widely varying supplies with excellent regulation. the extremely low power drain of the lm185-1.2 makes it useful for micropower circuitry. this voltage reference can be used to make portable meters, regulators or general purpose analog circuitry with battery life approaching shelf life. further, the wide operating current allows it to replace older references with a tighter tolerance part. connection diagrams figure 1. lccc package figure 2. to package ? bottom view see package number naj0020a see package number ndu0002a 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 all trademarks are the property of their respective owners. production data information is current as of publication date. copyright ? 2005 ? 2014, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters.
lm185-1.2qml snvs384b ? october 2005 ? revised january 2014 www.ti.com figure 3. clga package see package number nac0010a schematic diagram these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 2 submit documentation feedback copyright ? 2005 ? 2014, texas instruments incorporated product folder links: lm185-1.2qml 1 2 3 4 10 9 8 7 5 6 +v ref nc nc nc nc nc nc nc nc v-
lm185-1.2qml www.ti.com snvs384b ? october 2005 ? revised january 2014 absolute maximum ratings (1) reverse current 30ma forward current 10ma operating temperature range ? 55 c t a +125 c maximum junction temperature (t jmax ) (2) +150 c storage temperature ? 55 c t a +150 c lead temperature (soldering 10 clga 260 c seconds) to package 300 c 20ld lccc package 300 c thermal resistance ja to (still air) 300 c/w to (500lf / min air flow) 139 c/w 20ld lccc (still air) 100 c/w 20ld lccc (500lf / min air 73 c/w flow) clga (still air) 194 c/w clga (500lf / min air flow) 128 c/w jc to 57 c/w 20ld lccc 25 c/w clga 23 c/w package weight (typical) to tbd 20ld lccc tbd clga 210mg esd tolerance (3) 4kv (1) absolute maximum ratings indicate limits beyond which damage to the device may occur. operating ratings indicate conditions for which the device is functional. for specifications and test conditions, see the electrical characteristics. the specifications apply only for the test conditions listed. some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) the maximum power dissipation must be derated at elevated temperatures and is dictated by t jmax (maximum junction temperature), ja (package junction to ambient thermal resistance), and t a (ambient temperature). the maximum allowable power dissipation at any temperature is p dmax = (t jmax - t a )/ ja or the number given in the absolute maximum ratings, whichever is lower. (3) human body model, 1.5k ? in series with 100pf. quality conformance inspection table 1. mil-std-883, method 5005 - group a subgroup description temp c 1 static tests at 25 2 static tests at 125 3 static tests at -55 4 dynamic tests at 25 5 dynamic tests at 125 6 dynamic tests at -55 7 functional tests at 25 8a functional tests at 125 8b functional tests at -55 9 switching tests at 25 10 switching tests at 125 11 switching tests at -55 12 settling time at 25 13 settling time at 125 14 settling time at -55 copyright ? 2005 ? 2014, texas instruments incorporated submit documentation feedback 3 product folder links: lm185-1.2qml
lm185-1.2qml snvs384b ? october 2005 ? revised january 2014 www.ti.com lm185 ? 1.2 electrical characteristics dc parameters sub- symbol parameter conditions notes min max units groups v ref reverse breakdown voltage i r = 10 a 1.223 1.247 v 1 i r = 20 a 1.205 1.26 v 2, 3 i r = 1ma 1.223 1.247 v 1 1.205 1.26 v 2, 3 i r = 20ma 1.223 1.247 v 1 1.205 1.26 v 2, 3 v ref / i r reverse breakdown voltage 10 a i r 1ma -1.0 1.0 mv 1 change with current 20 a i r 1ma -1.5 1.5 mv 2, 3 1ma i r 20ma -10.0 10.0 mv 1 -20.0 20.0 mv 2, 3 v f forward bias voltage i f = 2ma -1.0 -0.4 v 1 lm185 ? 1.2 electrical characteristics dc drift parameters delta calculations performed on qmlv devices at group b, subgroup 5, unless otherwise specified on the ipi. sub- symbol parameter conditions notes min max units groups v r reverse breakdown voltage i r = 10 a -0.01 0.01 v 1 i r = 20ma -0.01 0.01 v 1 lm185by ? 1.2 electrical characteristics dc parameters sub- symbol parameter conditions notes min max units groups v ref reverse breakdown voltage i r = 10 a 1.223 1.247 v 1 i r = 20 a 1.205 1.26 v 2, 3 i r = 1ma 1.223 1.247 v 1 1.205 1.26 v 2, 3 i r = 20ma 1.223 1.247 v 1 1.205 1.26 v 2, 3 v ref / i r reverse breakdown voltage 10 a i r 1ma -1.0 1.0 mv 1 change with current 20 a i r 1ma -1.5 1.5 mv 2, 3 1ma i r 20ma -10.0 10.0 mv 1 -20.0 20.0 mv 2, 3 v f forward bias voltage i f = 2ma -1.0 -0.4 v 1 t c temperature coefficient (1) 50 ppm/ c 2, 3 (1) the average temperature coefficient is defined as the maximum deviation of reference voltage, at all measured temperatures between the operating t min & t max , divided by (t max ? t min ). the measured temperatures (t measured ) are ? 55 c, 25 c, & 125 c or v ref / (t max ? t min ) 4 submit documentation feedback copyright ? 2005 ? 2014, texas instruments incorporated product folder links: lm185-1.2qml
lm185-1.2qml www.ti.com snvs384b ? october 2005 ? revised january 2014 lm185-1.2rlqv smd 5962r8759461 post 100 krad electrical characteristics dc parameters (1) (2) sub- symbol parameter conditions notes min max units groups v ref change in reverse breakdown i r = 10 a (3) -3 3 % 1 voltage i r = 1ma (3) -3 3 % 1 i r = 20ma (3) -2.5 2.5 % 1 v ref / i r reverse breakdown voltage 10 a i r 1ma -15 15 mv 1 change with current 1ma i r 20ma -25 25 mv 1 v f forward bias voltage i f = 2ma -1.0 -0.4 v 1 (1) radiation hardness assured (rha) products are those with an " rlqv " suffix in the texas instruments ' part number or those with an " r " in the smd number, following " 5962 " . (2) testing and qualification for rha products is done on a wafer level according to mil-std-883, test method 1019. testing is performed with a 1.5x overtest. to be rated at 100 krad(si) units are tested to 150 krad(si) with all parameters remaining inside the post 100 krad electrical dc test limits in this table. interim test points are taken at 50, 75 and 100 krad(si). (3) change from the 0 rad reading. copyright ? 2005 ? 2014, texas instruments incorporated submit documentation feedback 5 product folder links: lm185-1.2qml
lm185-1.2qml snvs384b ? october 2005 ? revised january 2014 www.ti.com typical performance characteristics reverse characteristics reverse characteristics figure 4. figure 5. temperature drift of 3 forward characteristics representative units figure 6. figure 7. reverse dynamic impedance reverse dynamic impedance figure 8. figure 9. 6 submit documentation feedback copyright ? 2005 ? 2014, texas instruments incorporated product folder links: lm185-1.2qml
lm185-1.2qml www.ti.com snvs384b ? october 2005 ? revised january 2014 typical performance characteristics (continued) noise voltage filtered output noise figure 10. figure 11. response time figure 12. figure 13. v ref radiation drift at i r = 10 a figure 14. v ref radiation drift at i r = 20 ma copyright ? 2005 ? 2014, texas instruments incorporated submit documentation feedback 7 product folder links: lm185-1.2qml 1.20 1.21 1.22 1.23 1.24 1.25 0 50 100 150 reference voltage (v) radiation level (krad) low dose rate biased low dose rate unbiased c002 1.20 1.21 1.22 1.23 1.24 1.25 0 50 100 150 reference voltage (v) radiation level (krad) low dose rate biased low dose rate unbiased c001
lm185-1.2qml snvs384b ? october 2005 ? revised january 2014 www.ti.com typical applications figure 15. wide input range reference figure 16. micropower reference from 9v battery figure 17. reference from 1.5v battery *i q ? 30 a figure 18. micropower* 5v regulator 8 submit documentation feedback copyright ? 2005 ? 2014, texas instruments incorporated product folder links: lm185-1.2qml
lm185-1.2qml www.ti.com snvs384b ? october 2005 ? revised january 2014 *i q ? 20 a standby current figure 19. micropower* 10v reference figure 20. precision 1 a to 1ma current sources copyright ? 2005 ? 2014, texas instruments incorporated submit documentation feedback 9 product folder links: lm185-1.2qml
lm185-1.2qml snvs384b ? october 2005 ? revised january 2014 www.ti.com meter thermometers calibration 1. short lm385-1.2, adjust r3 for i out = temp at 1 a/ k 2. remove short, adjust r2 for correct reading in centigrade ? i q at 1.3v ? 500 a i q at 1.6v ? 2.4ma figure 21. 0 c ? 100 c thermometer *2n3638 or 2n2907 select for inverse h fe ? 5 ? select for operation at 1.3v ? i q ? 600 a to 900 a figure 22. lower power thermometer calibration 1. short lm385-1.2, adjust r3 for i out = temp at 1.8 a/ k 2. remove short, adjust r2 for correct reading in f figure 23. 0 f ? 50 f thermometer 10 submit documentation feedback copyright ? 2005 ? 2014, texas instruments incorporated product folder links: lm185-1.2qml
lm185-1.2qml www.ti.com snvs384b ? october 2005 ? revised january 2014 calibration 1. adjust r1 so that v1 = temp at 1mv/ k 2. adjust v2 to 273.2mv ? i q for 1.3v to 1.6v battery volt- age = 50 a to 150 a typical supply current 50 a figure 24. centigrade thermometer adjustment procedure 1. adjust tc adj pot until voltage across r1 equals kelvin temperature multiplied by the thermocouple seebeck coefficient. 2. adjust zero adj pot until voltage across r2 equals the thermocouple seebeck coefficient multiplied by 273.2. figure 25. micropower thermocouple cold junction compensator seebeck voltage voltage thermocouple r1 r2 coefficient across r1 across r2 type ( ) ( ) ( v/ c) @ 25 c (mv) (mv) j 52.3 523 1.24k 15.60 14.32 t 42.8 432 1k 12.77 11.78 k 40.8 412 953 12.17 11.17 s 6.4 63.4 150 1.908 1.766 copyright ? 2005 ? 2014, texas instruments incorporated submit documentation feedback 11 product folder links: lm185-1.2qml
lm185-1.2qml snvs384b ? october 2005 ? revised january 2014 www.ti.com revision history section released revision section originator changes 10/07/05 a new release, corporate format l. lytle 2 mds data sheets converted into one corp. data sheet format. mnlm185-1.2-x rev 2a3 and mnlm185by-1.2-x rev 0b0 data sheets will be archived. 03/27/13 a all changed layout of national data sheet to ti format 01/07/14 b features, electrical characteristics, k. kruckmeyer added post irradiation test limits and typical typical performance characteristics radiation drift plots for radiation qualified option. 12 submit documentation feedback copyright ? 2005 ? 2014, texas instruments incorporated product folder links: lm185-1.2qml
package option addendum www.ti.com 28-jul-2016 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples 5962-8759401vxa lifebuy to ndu 2 20 tbd call ti call ti -55 to 125 8759401vxa q 5962-8759401vya lifebuy cfp nac 10 54 tbd call ti call ti -55 to 125 lm185wg -1.2-qv q 5962-87594 01vya aco 01vya >t 5962-8759401xa active to ndu 2 20 tbd call ti call ti -55 to 125 8759401xa q 5962-8759401ya active cfp nac 10 54 tbd call ti call ti -55 to 125 lm185wg -1.2/883 q 5962-87594 01ya aco 01ya >t 5962-8759405xa active to ndu 2 20 tbd call ti call ti -55 to 125 8759405xa q 5962r8759461vxa active to ndu 2 20 tbd call ti call ti -55 to 125 r8759461vxa q lm185byh1.2-smd active to ndu 2 20 tbd call ti call ti -55 to 125 8759405xa q lm185h-1.2-qv lifebuy to ndu 2 20 tbd call ti call ti -55 to 125 8759401vxa q lm185h-1.2-smd active to ndu 2 20 tbd call ti call ti -55 to 125 8759401xa q lm185h-1.2/883 active to ndu 2 20 tbd call ti call ti -55 to 125 lm185-1.2 q lm185h-1.2rlqv active to ndu 2 20 tbd call ti call ti -55 to 125 r8759461vxa q lm185wg-1.2-qv lifebuy cfp nac 10 54 tbd call ti call ti -55 to 125 lm185wg -1.2-qv q 5962-87594 01vya aco 01vya >t lm185wg-1.2/883 active cfp nac 10 54 tbd call ti call ti -55 to 125 lm185wg -1.2/883 q 5962-87594 01ya aco 01ya >t lm185wg-1.2rlqv preview cfp nac 10 54 tbd call ti call ti -55 to 125 lm185wg -1.2rlqv q
package option addendum www.ti.com 28-jul-2016 addendum-page 2 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples (5962-87594 ~ 5962r87594) (01vya aco ~ 61vya aco) 01vya >t (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
package option addendum www.ti.com 28-jul-2016 addendum-page 3 other qualified versions of lm185-1.2qml, lm185-1.2qml-sp : ? military: lm185-1.2qml ? space: lm185-1.2qml-sp note: qualified version definitions: ? military - qml certified for military and defense applications ? space - radiation tolerant, ceramic packaging and qualified for use in space-based application
mechanical da t a nac0010a www .ti.com w g 1 0 a ( r e v h )
mechanical da t a ndu 000 2a www .ti.com h 0 2 a ( r e v f )
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? 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